Micron Size & PSD
Compare size designations, particle-size distribution, measurement methods and oversized-particle requirements.
SinoDiam supplies micron-size diamond abrasives for manufacturers of precision grinding tools, lapping compounds, polishing slurries and specialized industrial diamond products.
Explore three general-purpose micron grades and four specialty products. Compare particle characteristics, grading requirements, application methods and the information needed for technical evaluation.
Micron diamond powders are selected for fine grinding, lapping, polishing and specialized manufacturing processes where abrasive size, morphology, surface condition and process compatibility matter.
Micron diamond powder is supplied in micrometer-scale abrasive fractions for applications that require finer particle-size selection than conventional coarse mesh diamond grit. Actual particle behavior depends on the grade, distribution, morphology, surface condition and working environment.
SinoDiam organizes its portfolio into three general-purpose grades and four specialty products. These two groups serve different selection needs: the general series provides a grade-positioning framework, while specialty products address distinct manufacturing routes or abrasive structures.
Compare size designations, particle-size distribution, measurement methods and oversized-particle requirements.
Consider irregular, blocky-oriented or agglomerated particle structures according to the selected grade and process.
Evaluate the diamond powder within the intended grinding wheel, diamond paste, polishing slurry or specialist manufacturing system.
Start with your workpiece and manufacturing process. Review the individual product pages for technical selection details and quotation support.
Three product positions for general grinding, lapping and polishing. Economy, Standard and Premium are portfolio classifications, not guaranteed numerical performance rankings.
Irregular, angular diamond abrasive positioned for cost-conscious grinding, lapping and polishing formulations.
General-purpose micron abrasive for evaluating a balance of grinding behavior, particle grading and finishing requirements.
Premium-positioned diamond micron powder for precision finishing where PSD, particle shape and surface requirements deserve close evaluation.
These four products serve different manufacturing applications. They are not additional grades in the Economy-to-Premium sequence.
Specialty synthetic diamond micron powder for evaluating polycrystalline diamond manufacturing. Particle packing, chemical impurities, cleanliness and HPHT sintering requirements are important.
Specialty micron diamond for fixed-abrasive wire saw manufacturing. Selection focuses on grading, crystal morphology, abrasive exposure and retention in the finished wire.
Specialty micron diamond for polishing processes where oversize particles, agglomeration, powder cleanliness and finished-surface quality require careful evaluation.
Agglomerated diamond abrasive distinguished by larger secondary structures assembled from finer diamond grains. Primary grain size and agglomerate size require separate evaluation.
Grade labels and specialty applications guide initial selection. Current size availability, particle characteristics and process suitability must be confirmed for each model. No fixed performance improvement or direct competitor-grade equivalence is implied.
Use this table to identify the right product family before comparing detailed micron-size and process specifications.
| Product | Classification | Primary Evaluation Focus | Typical Application Direction |
|---|---|---|---|
| SND-M05 | Economy | General irregular-particle abrasive, cost and processing balance | Stone, ceramics, gemstones, general lapping |
| SND-M10 | Standard | Particle grading, removal behavior and finishing balance | Glass, ceramics, carbide, paste and slurry trials |
| SND-M15 | Premium | Precision processing, PSD and surface characteristics | Optical glass, ceramics, precision polishing |
| SND-M/PCD | Specialty | Impurity requirements, powder packing, HPHT compatibility | PCD/PDC feedstock manufacturing |
| SND-MDW | Specialty | Grain morphology, PSD, exposure and wire retention | Fixed-abrasive diamond wire manufacturing |
| SND-MPL | Specialty | Oversize control, dispersion and surface-quality requirements | Precision lapping and polishing |
| SND-MAG | Specialty | Primary grains, secondary agglomerates and breakdown behavior | Agglomerated-abrasive lapping and polishing |
This table reflects product positioning rather than measured strength, purity or PSD rankings. Grade-specific test results are needed for final material qualification.
Choosing a nominal micron size is only the first step. PSD, morphology, oversize content and the measurement method can be decisive in precision abrasive selection.
Evaluate for earlier grinding or lapping stages where material-removal requirements permit larger abrasive particles.
Consider when removal rate, abrasive contact and surface requirements need to be balanced.
Evaluate for controlled finishing, especially where oversize particles, agglomeration or contamination may affect the surface.
These distribution points describe measured particle-size populations under a stated method and reporting basis. The same nominal size does not guarantee identical distributions between suppliers.
Rare oversized grains may cause isolated scratches during sensitive finishing. Acceptable limits should be defined for the actual workpiece and inspection method.
Angular, blocky, fractured and agglomerated structures can present different contact geometries. Representative microscopy can supplement PSD data.
Sample preparation, liquid carriers and agglomeration can influence measured size and actual polishing behavior. Test methods should be comparable across suppliers.
For agglomerated micron diamond, distinguish primary diamond particle size from secondary agglomerate size. A single reported D50 value does not identify both populations. Request separate characterization where the distinction matters.
Micron-size fractions, D10/D50/D90 limits and oversize specifications vary by product and may depend on the measurement method. The entire series should not be assigned one universal size or tolerance guarantee.
Different processing steps require different diamond powder characteristics. Select the abrasive according to workpiece, tool architecture and finished-surface requirements.
Micron diamond abrasives for suitable glass, technical ceramic, carbide and other hard-material grinding or lapping systems.
Explore SND-M10 →Precision finishing evaluations where particle-size tails, surface damage and polishing formulation require careful control.
Explore SND-MPL →General and precision polishing of selected gemstone and ceramic workpieces using appropriate diamond size and processing conditions.
Explore SND-M05 →Diamond powder selection for polishing compounds and liquid abrasive formulations, considering wetting, dispersion and sedimentation.
Explore SND-M15 →Micron diamond used in fixed-abrasive wire-saw development for selected silicon, SiC, sapphire and related hard-brittle cutting processes.
Explore SND-MDW →Specialized micron diamond feedstock for polycrystalline material manufacturing, where impurity control, PSD and sintering conditions matter.
Explore SND-M/PCD →Applications are intended technical evaluation directions. Semiconductor-device manufacturing qualification, scratch-free polishing, exact Ra values and finished-tool performance require separate evidence.
Micron diamond powder selection should consider how abrasive particles are retained, dispersed and presented to the workpiece.
Consider particle morphology, abrasive concentration, grain exposure and matrix retention. Suitable grades require wheel-formulation trials.
Evaluate particle grading, carrier viscosity, abrasive loading, mixing and storage behavior in the finished compound.
Review wetting, dispersion, agglomeration, sedimentation and compatibility with the selected liquid chemistry.
Consider carrier chemistry, particle surface condition, separation and abrasive distribution under working conditions.
For SND-MDW evaluation, grain retention depends on the complete wire core, particle preparation, plating interface and deposition process.
SND-M/PCD is evaluated under a different manufacturing route, with specific PSD, impurity, packing and HPHT processing requirements.
No. Resin, metal, vitrified, electroplated, water-based and oil-based systems impose different requirements on abrasive particles. Compatibility must be assessed for the selected grade, processing conditions and finished-tool formulation.
Start with the application rather than assuming that the finest particle or highest grade label will always provide the best result.
Define the material: stone, glass, ceramic, carbide, gemstone, sapphire, SiC, PCD material or another substrate. Include surface sensitivity and contamination requirements.
Specify grinding, lapping, polishing, diamond paste, slurry, diamond wire manufacturing or PCD/PDC feedstock production.
Select the micron-size designation, PSD, morphology, surface characteristics and carrier or bond requirements. For SND-MAG, specify both grain and agglomerate size.
Compare material removal, surface finish, particle retention, dispersion or sintering results under relevant conditions. Review overall processing cost before substitution.
To recommend a relevant product, SinoDiam may need your workpiece material, processing operation, requested micron size, size distribution, existing abrasive grade, bond or slurry formulation, surface-quality target, trial quantity, delivery destination and any critical documentation requirements.
Practical answers about micron diamond applications, grades, particle size, slurry formulation and specialty abrasive selection.
Whether you manufacture grinding tools, diamond polishing compounds, precision wire saws or polycrystalline diamond materials, selecting the correct abrasive starts with understanding the application and particle specification.
Share your required grade, target micron size, particle-size distribution requirements, workpiece, tool or slurry system, trial quantity and destination. SinoDiam can discuss current specifications and application-based material selection.
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