Diamond Micron Size
Particle size, PSD and morphology influence material removal and finishing behavior.
SinoDiam International · Specialty Diamond Materials
Diamond Compound Pastes for Precision Lapping & Polishing
Explore SinoDiam's SND210 oil-soluble and SND220 water-soluble synthetic diamond polishing compounds for selected industrial finishing, mold and die polishing, metallographic preparation and precision lapping applications.
Compare carrier compatibility, diamond micron size, abrasive concentration and polishing requirements to identify a suitable compound for your process.
SND210 · Oil-Soluble
SND220 · Water-Soluble
Micron Diamond
Precision Finishing
Product specifications, micron sizes and
concentrations are confirmed by formulation.
SinoDiam SND210 & SND220 Industrial Diamond Polishing Compounds
01 / Technical Overview
Diamond Abrasives for Controlled Lapping & Polishing
Diamond compound performance depends on both the abrasive particles and the carrier. The right selection starts with the workpiece and polishing method.
Diamond polishing compound combines industrial diamond abrasive particles with a carrier system that allows the abrasive to be distributed across a polishing surface.
SinoDiam's SND210 and SND220 products use different carrier approaches. SND210 is oil-based, while SND220 is water-compatible. The selection should consider the substrate, polishing medium, abrasive size, diamond loading and cleaning process.
Oil or Water Compatibility
The carrier affects handling, distribution, lubrication and cleanup requirements.
Diamond Concentration
Abrasive loading and dispersion should match the intended polishing stage and equipment.
Diamond Particles and Carrier Are Different Components
Oil-soluble and water-soluble refer to the compound carrier systems. Diamond particles do not dissolve in oil or water. A suitable cleaning process must consider both carrier residues and remaining abrasive particles.
02 / Diamond Compound Portfolio
Explore SinoDiam SND210 & SND220 Diamond Compounds
Two carrier systems for different industrial polishing workflows. Compare the product specifications and application direction before selection.
Two Compound Formulations
Choose the Carrier Around Your Polishing Process
SND210 and SND220 are both diamond compound products, but their carrier compatibility and application requirements are different.
Product 01 · Oil-Based Carrier
SND210 Oil-Soluble Diamond Compound
Mold & Die Polishing · Precision Lapping
Synthetic diamond polishing paste with an oil-based carrier for selected carbide die finishing, mold polishing and precision toolroom applications.
Important selection factors include micron size, diamond concentration, carrier compatibility, polishing medium and post-process cleaning.
Application evaluation:
Carbide drawing dies, compatible
mold inserts, precision lapping
and selected hard-material polishing.
Explore SND210 Oil-Soluble Compound →
Product 02 · Water-Compatible Carrier
SND220 Water-Soluble Diamond Compound
Metallography · Laboratory Polishing
Synthetic diamond polishing paste with a water-compatible carrier for selected metallographic preparation, laboratory lapping and technical ceramic finishing.
Important selection factors include specimen material, particle-size distribution, polishing cloth, water sensitivity and cleanup.
Application evaluation:
Metallographic specimens,
technical ceramics, precision
components and selected
laboratory cross-section preparation.
Explore SND220 Water-Soluble Compound →
Current micron-size availability, diamond loading, packaging and other formulation details should be confirmed for each product. Application descriptions are technical selection directions.
03 / Carrier Comparison
Oil-Soluble vs. Water-Soluble Diamond Compound
Compare the carrier, polishing workflow, workpiece compatibility and cleaning requirements before selecting a diamond compound.
| Selection Factor | SND210 Oil-Soluble | SND220 Water-Soluble |
|---|---|---|
| Carrier | Oil-based / oil-compatible | Water-soluble / water-compatible |
| Main Evaluation Direction | Carbide die polishing, mold finishing and precision toolroom applications | Metallographic specimen preparation, laboratory lapping and selected precision polishing |
| Polishing Medium | Evaluate with oil-compatible polishing cloths, laps and extenders | Evaluate with water-compatible polishing cloths, laps and extenders |
| Cleaning | Requires a suitable oil-compound cleaning procedure | Water-based cleanup may be appropriate; abrasive particles still require removal |
| Workpiece Compatibility | Confirm carrier residues, surface requirements and downstream processing | Confirm water sensitivity, corrosion risk and formulation compatibility |
| Diamond Micron Size | Confirm by current specification | Confirm by current specification |
| Diamond Concentration | Confirm loading and reporting basis | Confirm loading and reporting basis |
| Surface Quality | Depends on abrasive and process validation | Depends on abrasive and process validation |
| Product Details | View SND210 → | View SND220 → |
This table compares carrier-system selection factors. It does not imply that either product is universally more effective, more lubricating or easier to clean.
04 / Diamond Particle Size
How to Select Diamond Micron Size for Polishing
Particle size should be matched to the workpiece, processing stage, required surface finish and inspection method.
A nominal micron size is only one part of the abrasive specification. Particle-size distribution, crystal morphology and oversized grains can also influence polishing behavior.
0.25–3 µm
Surface Refinement
Consider for suitable late-stage finishing operations where fine abrasive contact and oversize control are important.
3–15 µm
Controlled Lapping
Evaluate for selected processes requiring a balance between material removal and surface quality.
15–50 µm
Pre-Finishing
Consider for suitable earlier stages where more pronounced abrasive contact is acceptable and later finishing may follow.
Particle-Size Distribution Matters
D10, D50 and D90 describe points within a measured particle-size distribution. A nominal size label does not automatically equal D50, and sensitive polishing may require additional oversize particle control.
The ranges above are general application examples, not a verified inventory list for SND210 or SND220.
05 / Abrasive Loading & Formulation
Diamond Concentration & Compound Formulation
Diamond content, dispersion and carrier behavior are important when comparing polishing compounds.
Light Concentration
May be evaluated for selected finishing operations requiring lower abrasive loading. Verify the actual concentration.
Medium Concentration
An intermediate loading option to evaluate where abrasive distribution and material removal need to be balanced.
Heavy Concentration
Higher loading may be considered for suitable removal-oriented processes. It does not guarantee faster or better polishing.
Diamond Content
Concentration may be reported as diamond mass fraction, abrasive mass per package, carat content or supplier-defined grades. Always confirm the basis.
Carrier & Dispersion
Carrier viscosity, particle morphology and abrasive loading affect the distribution and handling of diamond particles during polishing.
Packaging & Dispensing
Confirm current tube, syringe or jar availability, net compound weight and suitable dispensing requirements.
Product Qualification
Compare formulations through representative polishing tests. Review removal behavior, surface quality and post-process cleanliness.
What Should Be Confirmed Before Ordering?
Request the product model, diamond particle size, PSD, concentration reporting basis, carrier specifications, package size and appropriate handling guidance.
06 / Industrial Applications
Applications of SinoDiam Diamond Polishing Compounds
Select a polishing compound according to the material, abrasive requirement, processing equipment and cleanup method.
Carbide Drawing Dies
Selected cemented carbide dies may be polished using suitable diamond compound formulations. Evaluate size and finish targets.
Explore SND210 →Mold & Die Finishing
Oil-compatible polishing operations for suitable mold inserts and precision tooling surfaces.
Explore SND210 →Metallographic Preparation
Selected metallographic cross-sections and laboratory specimens where water-compatible diamond compound is appropriate.
Explore SND220 →Technical Ceramic Polishing
Evaluate diamond abrasive compounds for suitable engineering ceramics, considering brittle damage and surface requirements.
Explore SND220 →Precision Toolroom Lapping
Selected tooling components requiring localized material removal or controlled surface refinement.
Explore SND210 →Laboratory Cross-Section Polishing
Suitable electronic component specimens and hard-material cross-sections for laboratory analysis, subject to contamination and damage control.
Explore SND220 →These applications are technical evaluation directions. Direct semiconductor wafer processing, guaranteed mirror finishes or cleanroom qualification are not established by the compound name alone.
07 / Product Selection Guide
How to Select the Right Diamond Polishing Compound
Define the complete polishing process before selecting SND210 or SND220.
Identify the Workpiece
Specify the material, hardness, initial surface and sensitivity to scratching, corrosion or water exposure.
Choose the Carrier System
Select oil-compatible or water-compatible handling according to the polishing medium and cleaning process.
Define Micron Size & Concentration
Confirm the particle-size fraction, PSD requirements, diamond loading and preparation stage.
Validate Polishing & Cleanup
Evaluate surface roughness, scratches, removal behavior, remaining particles and processing consistency.
Diamond or CBN for the Workpiece?
Diamond is suitable for many hard and abrasive materials, including selected cemented carbides and ceramics. For certain hardened ferrous materials, CBN-based abrasive products may be more appropriate. CBN paste availability should be confirmed separately rather than assumed for SND210 or SND220.
08 / SinoDiam Technical Support
Application-Focused Diamond Compound Selection
SinoDiam supports technical discussions covering synthetic diamond abrasives, polishing compound selection and international supply requirements.
Oil & Water Carrier Options
Two compound families allow customers to evaluate different handling and polishing requirements.
Specification-Based Selection
Compare diamond grade, micron size, concentration, carrier compatibility and application needs.
China & Thailand Operations
Discuss industrial diamond materials through SinoDiam's international operations. Availability and origin are confirmed by order.
09 / Technical FAQ
Frequently Asked Questions — Diamond Compound Pastes
Common questions about oil-soluble and water-soluble diamond compounds, particle size and polishing selection.
1. What is diamond polishing compound?
Diamond polishing compound is a paste containing diamond abrasive particles dispersed in a suitable carrier. It is used in selected lapping and polishing operations.
2. What is the difference between SND210 and SND220?
SND210 is SinoDiam's oil-soluble diamond compound, while SND220 is its water-soluble diamond compound. Their main distinction is the carrier system and its compatibility with the polishing workflow and cleaning process.
3. Does water-soluble diamond paste dissolve completely in water?
No. Water solubility describes the carrier characteristics. Diamond abrasive particles remain solid and require suitable cleaning or removal.
4. Is oil-soluble diamond compound better for mold polishing?
Oil-based compound is an important option for selected mold and die polishing workflows. Whether it is preferable depends on the workpiece, lubricant compatibility, polishing method and cleanup.
5. Is SND220 suitable for metallographic preparation?
Metallographic specimen preparation is an important application evaluation direction for SND220. Diamond size, polishing cloth, specimen material and cleanliness must be considered together.
6. Which diamond micron size should I choose?
Start with the workpiece, initial surface and process stage. Coarser particles may be evaluated for earlier removal stages, while finer particles may be appropriate for selected finishing operations. Confirm the required PSD.
7. Does smaller diamond size guarantee a mirror finish?
No. Final finish depends on diamond size and morphology, oversized particles, polishing medium, pressure, contamination and workpiece characteristics.
8. How should diamond concentration be selected?
Select concentration according to the abrasive size, polishing process, carrier and material removal requirements. Confirm the actual diamond loading for the chosen formulation.
9. Are Light, Medium and Heavy universal concentration standards?
No. They are general concentration categories. Numerical diamond content and reporting methods may differ by formulation and manufacturer.
10. Can SND210 and SND220 be mixed together?
Do not assume the oil-based and water-compatible carrier systems are compatible. Mixing may affect dispersion, viscosity and polishing results. Obtain formulation-specific guidance before mixing.
11. Can diamond compounds polish hardened steel?
Abrasive selection for hardened ferrous materials requires care. CBN-based abrasives may be preferable for some processes. Workpiece suitability must be evaluated separately.
12. Is water-soluble diamond compound cleanroom-qualified?
No universal cleanroom, semiconductor wafer or residue-free qualification is established by the water-soluble designation. Such uses require separate contamination and process qualification.
13. What packaging options are available?
Historical SinoDiam catalogues reference different syringe, tube and jar configurations. Current package sizes, net compound weight and availability require confirmation.
14. What information is needed for a quotation?
Please provide the workpiece, polishing method, required micron size, diamond concentration, preferred carrier, cleaning needs, estimated quantity, packaging preference and delivery destination.
SinoDiam International · Diamond Compound Technical Support
Looking for the Right Diamond Polishing Compound?
Whether your process involves carbide die polishing, precision mold finishing, metallographic preparation, laboratory lapping or suitable hard-material polishing, selecting the right diamond compound starts with the workpiece and application.
Share your required micron size, diamond concentration, preferred oil- or water-compatible carrier, polishing method, surface-quality target, expected quantity and delivery destination.
SinoDiam can discuss relevant SND210 and SND220 product specifications and the information needed to evaluate your polishing process.
Request Technical Information & Quotation →