Explore five synthetic diamond material families for cutting-tool manufacturing, bonded abrasive grinding, lapping and precision finishing. Compare grades by crystal characteristics, bond system and the workpiece you need to process.
Industrial Diamond Abrasive Grains
Saw Grit Diamond
Micron Diamond PowderStart with the tool design, abrasive bond and surface-finish requirements. The right diamond grade cannot be selected by nominal particle size alone.
Mesh-size synthetic diamond crystals for manufacturing saw-blade segments, core bits and other cutting tools. Review crystal shape, toughness, impact load and metal-bond formulation.
Diamond mesh grades for metal-bond grinding wheels, glass processing, carbide sharpening and abrasive shaping tools. Compare grit strength and retention needs.
RVG-style friable diamond grits for resin-bond grinding and fine finishing. Choose the fracture and self-sharpening characteristics for your wheel and material.
Angular, crushed particles for selected grinding, polishing and electroplated or resin-bond abrasive applications. Distinct from manufactured RVG resin-bond mesh grades.
Controlled micron-size diamond particles for fine grinding, lapping, polishing and specialist manufacturing. Applications include optics, hard materials, wire-saw formulations and selected PCD/PDC feedstock.
Several powder families may be described as grinding abrasives. They are not automatically interchangeable: crystal structure, friability, particle size and retention requirements must be considered together.
Metal Bond Mesh is typically evaluated for grit strength and retention in metal-matrix tools. Resin Bond Diamond is commonly selected for its controlled friability and self-sharpening behavior in resin wheels. Neither selection is based on the workpiece alone; the bond, tool design and operating regime matter.
RVG-style Resin Bond grades emphasize a defined friability profile for bonded grinding. Crushed RVD describes fractured diamond particles with angular morphology, used in a range of abrasive systems. Confirm particle shape, mesh and tool requirements before choosing between them.
Saw Grit supplies larger crystals for cutting-tool segments and related tooling. Micron Diamond supports finer abrasive processes where particle-size distribution, dispersion, contamination and surface finish become more prominent selection variables.
M05 / M10 / M15 serve general-to-higher-precision micron powder requirements. MAG, MPL, MDW and M/PCD address narrower process or manufacturing needs. Their suitability needs to be checked against the target substrate and production method.
These families help narrow the discussion. Actual grades, mesh/micron distributions and proposed use should be confirmed against the corresponding product specification.
| Material family | SinoDiam series | Typical evaluation focus |
|---|---|---|
| Saw Grit Diamond | SND815 / 820 / 830 / 840 / 860 / 880 / 890 | Crystal shape, relative toughness, cutting impact, segment bond, mesh and tool design. SND815 may be considered for blending. |
| Metal Bond Mesh | SND-G20 / G30 / G40 / G60 | Metal-bond grit retention, grinding duty, workpiece, shape and MBD-equivalent grade reference. |
| Resin Bond Diamond | SND-R05 / R10 / R15 / R20 | Friability, self-sharpening, wheel bond, removal rate and desired finish. |
| Crushed RVD Diamond | SND-G05 / G10 / G15 | Fractured particle morphology, toughness level, mesh and abrasive-tool construction. |
| Micron Diamond | SND-M05 / M10 / M15 | Micron size distribution, surface requirements, dispersion and purity needs. |
| Specialty Micron | MAG / MPL / M/PCD / MDW | Agglomeration, precision finishing, polycrystalline feedstock or wire-saw tool design as applicable. |
Grade descriptions are selection guidance, not guaranteed performance values or a substitute for technical validation. Mesh and micron availability can vary by grade and processing route.
Two customers machining the same material may require different diamond powders because their bond systems, production conditions and quality targets differ.
Define the workpiece. Stone, concrete, carbide, ceramic, glass, sapphire, SiC or other hard substrates.
Describe the operation. Sawing, drilling, grinding, lapping, polishing, wire-saw production or PCD/PDC feedstock.
Match the abrasive system. Metal or resin bond, mesh/micron size, crystal morphology, coating and tooling conditions.
Validate in production. Evaluate removal rate, finish, tool wear, process stability and overall economics.
Our operations support material selection, specialized processing and international supply discussions across a range of synthetic industrial diamond products.
Activities in China include industrial diamond product development, manufacturing and specialized material processing, together with technical coordination for international customers.
Discuss saw grit, bonded abrasive grades, micron powder requirements and related superabrasive materials with our team.
The Thailand operation focuses on production and processing related to crushed diamond, micron diamond powders and selected coated diamond materials.
The two-country structure offers additional options when reviewing manufacturing origin, processing requirements and supply arrangements.
These answers are general starting points for a technical discussion, not guarantees of performance in a particular tool.
Saw Grit Diamond is commonly considered for segment and core-tool production. The grade selection depends on crystal toughness and shape, mesh size, bond composition, cutting load and the stone or concrete being processed.
Metal-bond mesh diamonds are selected for metal-matrix abrasive systems where grit strength and retention matter. Resin-bond grades may emphasize controlled fracture and self-sharpening. The same workpiece can call for different grits depending on bond and grinding conditions.
Not necessarily. Crushed RVD refers to irregular diamond particles produced by crushing, while resin-bond/RVG grades are selected around the fracture behavior required by the resin tool system. There may be overlapping uses, but they should not be treated as identical specifications.
Consider micron diamond when finer abrasive particle control is required for lapping, polishing, fine grinding, selected wire-saw formulations or specialized feedstock. Confirm the target particle-size distribution and process conditions before choosing a grade.
The workpiece is a starting point, not a complete specification. Share the bond or carrier, tooling method, existing grit or micron size, target finish and operating conditions so the selection can be evaluated more meaningfully.
Include the material family, intended application, grade or mesh/micron size if known, bond or process, estimated quantity, destination and relevant evaluation requirements. If you do not know the grade, describe your current tool and manufacturing process.
Whether you're comparing saw grit grades, formulating a grinding wheel or selecting micron diamond for precision finishing, tell us what you need to manufacture. We can review relevant material families and quotation requirements.
