Resin Bond Diamond

SinoDiam Resin Bond Diamond Powder is a series of synthetic industrial diamond abrasives engineered for resin-bond grinding wheels, precision grinding, lapping and fine finishing applications.

Our RVG series includes SND-R05, SND-R10, SND-R15 and SND-R20, offering different combinations of crystal structure, friability, self-sharpening behavior and cutting performance to meet diverse abrasive tool manufacturing requirements.

These diamond materials are used in grinding and finishing tungsten carbide, ceramics, glass, optical components, precision molds and other hard or brittle materials. Selected grades can also be considered for compatible vitrified bond grinding systems.

The friability of resin bond diamond affects how abrasive grains fracture and expose fresh cutting edges during grinding. Grade selection depends on the workpiece material, bonding system, particle size, grinding conditions and desired balance between material removal efficiency, surface finish and tool life.

Explore the individual SND-R grades below to compare their characteristics and recommended applications. Contact SinoDiam to discuss suitable grades, available mesh sizes and your specific grinding tool manufacturing requirements.